Process Integration Engineer 18-125 - (Hillsboro, OR)

JOB DETAILS The Process Integration Engineer will provide a key technical role in the integration engineering functions of a wafer fabrication area in a semiconductor company. RESPONSIBILITIES/DUTIES Development of advanced Trench Power MOSFET and BCD process. 10% New product Introduction (NPI) and transfer technology to Fab. 10% Maintain Power MOSFET and BCD mass production. 60% Maintain good Cpk for CP/ET and monitor inline SPC parameters. 5% Propose process improvement, trouble shooting and Yield enhancement. 10% Trouble shooting of Product related issue, process/product reliability issue. 5% PHYSICAL REQUIREMENTS/WORK ATMOSPHERE Regularly required to sit or stand and move about the facility. Exposure to shop elements such as noise, dust, fumes and odors. EXPERIENCE/EDUCATION Min Bachelor in Physics, Electrical & Electronics Engineering, or Microelectronics. 2+ years of working experience in the semiconductor industry (will consider university Fab experience). Prefered